Fmoc-Sieber-TentaGel resin

Fmoc-Sieber amide resin is an acid-labile carrier for solid phase synthesis of peptide amides. Cleavage can be achieved with only 1% TFA in DCM making them an ideal carrier for the synthesis of protected peptide fragments in fragment condensation strategies for the synthesis of long peptides. It has also been used in organic synthesis of acid-sensitive compounds, for targeted synthesis of primary amines and N-alkylated secondary carboxyamides. References: P.Sieber, Tetrahedron Lett. 1987; 28: 2107. C.Somlai, et al. in „Peptides 1992, Proc. 22nd European Peptide Symposium“, C.H.Schneider & A.N.Eberle (Eds.) 1993; 198. P.Gupta, et al., Tetrahedron Lett. 2002; 58: 10469. W.C.Chan, et al., J.Chem.Soc.,Chem.Comm. 1995; 1475. W.C.Chan, et al., J.Chem.Soc.,Chem.Comm. 1995; 589. E.A.Boyd, et al., Tetrahedron Lett. 1996; 37: 1647. N.D.Home, et al., Tetrahedron Lett. 2002; 42: 1115. TentaGel® resins consist of low cross-linked polystyrene on which poly(ethylene glycol) with a molecular weight of 3000 Da is grafted. The PEG spacer is attached to the polymer matrix via an ether bond, which shows high stability towards acid treatment and minimizes PEG leaching. The properties of TentaGel® resins are dominated by PEG, which solubilizes both hydrophobic and hydrophilic compounds. TentaGel® resins are pressure stable and can be used in batch processes as well as under continuous flow conditions.